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Ceramic VS Fr4 Printed Circuit PCB Board

  • Jan 9
    Ceramic VS Fr4 Printed Circuit PCB Board



    If you are using a printed circuit board, you can use either a
    standard FR4 board or a metal core printed circuit board (MCPCB).
    Ceramic printed circuit boards are a metal core PCB that you might
    prefer. But we need to know the difference between the standard FR4
    board and the metal core board so that we can make the best choice for
    different uses.To get more news about fr4 board, you can visit pcbmake official website.

    Ceramic PCBs can only be seen in high-end products, and low-end products
    will not. It gradually replaces the entire printed circuit board to
    reduce design and manufacturing complexity while improving performance.



    Thermal conductivity



    With outstanding operating temperature, low expansion coefficient,
    high thermal conductivity, good insulation and thermal properties, the
    material itself is different, and ceramics have advantages over MCPCB.
    Ceramic PCBs exhibit high thermal conductivity. Ceramic substrates such
    as aluminum oxide, aluminum nitride and yttrium oxide are highly
    thermally conductive materials that rapidly and efficiently transfer
    heat away from hot spots to dissipate heat throughout the surface. PCB
    material (FR-4) is epoxy based and has poor thermal conductivity leading
    to hot spots, which reduces the lifetime of most semiconductor
    junctions. The thermal conductivity of alumina is about 20 times that of
    FR4. The thermal conductivity of aluminum nitride and silicon carbide
    is about 100 times, and the thermal conductivity of cerium oxide is
    higher. Boron nitride has the highest thermal conductivity so far.

    Ceramic plates have other benefits that are particularly useful in
    multilayer boards. The high thermal conductivity helps prevent hot spots
    from forming on the surface and internal circuit layers because the
    heat transfer throughout the board is more uniform. In contrast, FR4
    relies on metal structures or active cooling to transfer heat away from
    certain locations or layers of the board and is more likely to form hot
    spots on the FR4 PCB.



    Ceramic PCBs offer the best solution to prevent thermal cycling
    problems because they share a compatible CTE with lead-free ceramic chip
    carriers for higher thermal conductivity, higher stability and inertia.
    Three ceramic PCB practice catalogs: high temperature co-fired ceramic
    PCB, low temperature co-fired ceramic PCB and thick film ceramic PCB.
    Ceramics have ideal mechanical strength and can withstand high
    mechanical loads, including strong vibrations and shocks. This means
    that for the same applied force, the ceramic plate will tend to deform
    less than FR4.

    Metal core PCB materials other than aluminum and tantalum may include
    copper and steel alloys. Steel alloys provide stiffness that is not
    available in copper and aluminum, but are not as effective in heat
    transfer. As part of a printed circuit board, copper has the best
    transfer and heat dissipation capabilities, but it's a bit expensive -
    so companies that manufacture or buy many printed circuit boards o